LQ3399 core board
LQ3399 core board
LQ3399 core board
LQ3399 core board
LQ3399 core board



LQ3399 core board


CPU: RK3399, ARM dual-core Cortex-A72+quad-core Cortex-A53


Main frequency: 2.0GHz*2+1.5GHz*4


Memory: 2GB standard, 4GB can be customized in batches


Flash: Standard 16GB, 4GB/8GB/16GB emmc can be customized in batches


Operating system: Android6.0/Android7.1/Linux+Qt/Debian9



Core board appearance

LQ3399核心板

3399核心板正面

LQ3399核心板

3399 core board back

LQ3399核心板

3399 core board structure size drawing

The main parameters of the core board

System Configuration
CPURK3399
主频Quad-core A53 (1.4GHz) + dual-core A72 (2GHz)
RAMStandard 2GB, 4GB can be customized (x3399cv3 supports LPDDR3, x3399cv4 supports LPDDR4)
存储器4GB/8GB/16GB emmc optional, standard 16GB
Power ICUse RT808, support dynamic frequency modulation, etc.
LCD interfaceaudio port
Interface parameters
Support MIPI, EDP, HDMI interface output at the same time
Touch  interfaceCapacitive touch, USB or serial port can be used to extend resistive touch
AC97/IIS interface, support recording and playback
SD interface2 SDIO output channels
emmc  interfaceOnboard emmc interface, the pins are not led out separately
Ethernet interfaceSupport Gigabit Ethernet
USB HOST2.0  interface2CH HOST2.0
USB HOST3.0  interface2CH TYPE3.0
UART  interface5 serial ports, support serial ports with flow control
PWM  interface4 PWM outputs
IIC  interface7 IIC outputs
SPI  interface1 SPI output
ADC  interface1 ADC output
Camera  interface1 BT656/BT601, 1 MIPI output
HDMI  interfaceHigh-definition audio and video output interface, audio and video synchronous output
Main 3.3V input voltageSecondary 3.3V input voltageRTC input voltageOperating temperatureStorage temperature
Electrical characteristics
3.3V/4.3A (recommended to use 3.3V/5A input)
3.3V/300mA (cannot be mixed with the main 3.3V)
2.5 to 3V/5uA
The output voltage1.8V (can be used for backplane power supply, 0V after sleep)
-10~70 degrees [actual measurement can reach -40 degrees to 80 degrees]
-10~80 degrees
Pin pitchNumber of pins
Core board structure parameters
ExteriorStamp hole method
Core board size55mm*55mm*3mm
1.0mm
Pin pad size1.25mm*0.7mm
200PIN
Layer10 Floor





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